Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting-Reference-Cited by-同舟云学术

Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting

Published:2018-03 Issue: Volume:142 Page:340-349
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Lauener C.M.,Petho L.,Chen M.,Xiao Y.,Michler J.,Wheeler J.M.^ORCID

Funder

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference57 articles.

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3. Can microscale fracture tests provide reliable fracture toughness values? A case study in silicon;Jaya;J. Mater. Res.,2015

4. A novel approach for determining fracture toughness of hard coatings on the micrometer scale;Riedl;Scr. Mater.,2012

5. Measuring the fracture resistance of hard coatings;Liu;Appl. Phys. Lett.,2013

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