Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference29 articles.
1. Effect of iron and indium on IMC formation and mechanical properties of lead-free solder;Fallahi;Mater Sci Eng A,2012
2. Improved strength of boron-doped Sn–1.0Ag–0.5Cu solder joints under aging conditions;Choi;Intermetallics,2012
3. Formation of Ag3Sn plates in SnAgCu solder bumps
4. Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders;Kanlayasiri;J Alloys Compd,2010
5. Mechanisms of deformation in high-ductility Ce containing Sn–Ag–Cu solder alloys;Xie;Microelectron Reliab,2011
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1. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07
2. Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys;Journal of Thermal Analysis and Calorimetry;2024-05
3. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder;Physics of Metals and Metallography;2023-12-29
4. Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy;Journal of Materials Science: Materials in Electronics;2023-02
5. Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging;Materials Today Communications;2022-12
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