The mechanism of micro-cracks formation in ultrasonic-assisted water confined laser micromachining silicon-Reference-Cited by-同舟云学术

The mechanism of micro-cracks formation in ultrasonic-assisted water confined laser micromachining silicon

Published:2021-06 Issue: Volume:488 Page:126745
ISSN:0030-4018
Container-title:Optics Communications
language:en
Short-container-title:Optics Communications

Author:

Zhou Jia,Jiao Hui,Huang Yu-xing,Zhao Yu-huan,Liu Qing-yuan,Long Yu-hong,Zhong Zhi-xian,Bao Jia-ding

Funder

Guilin University of Electronic Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference28 articles.

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5. Ablation enhancement of silicon by ultrashort double-pulse laser ablation;Zhao;Appl. Phys. Lett.,2014

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