Development and implementation of a micromechanically motivated cohesive zone model for ductile fracture
Author:
Funder
Türkiye Bilimsel ve Teknolojik Araştırma Kurumu
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference69 articles.
1. Micro-mechanics based cohesive zone modeling of full scale ductile plate tearing: From initiation to steady-state;Andersen;Int. J. Solids Struct.,2019
2. Cohesive traction–separation relations for tearing of ductile plates with randomly distributed void nucleation sites;Andersen;Int. J. Fract.,2020
3. ASTM: E. 1820-01, 2003. Standard Test Method for determining Measurement of Fracture Toughness. Standard.
4. Triaxiality dependent cohesive zone model;Banerjee;Eng. Fract. Mech.,2009
5. The formation of equilibrium cracks during brittle fracture. General ideas and hypotheses. Axially-symmetric cracks;Barenblatt;J. Appl. Math. Mech.,1959
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