Plasma polymerization of CF4 + H2 mixtures on the surface of polyethylene and polyvinylidene flouride substrates
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference12 articles.
1. Radiofrequency plasma decomposition of C n F2n+2-H2 and CF4-C2F4 mixtures during Si etching or fluoropolymer deposition
2. Metal-containing fluoropolymer films produced by simultaneous plasma etching and polymerization: The series of perfluoroalkanes nF2n+2 (n = 1,2,3,4)
3. Thin Film Process;Yasuda,1978
4. Mechanisms of etching and polymerization in radiofrequency discharges of CF4–H2, CF4–C2F4, C2F6–H2, C3F8–H2
5. Polymer film formation in C2F6H2 discharges
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1. Necking Reduction at Low Temperature in Aspect Ratio Etching of SiO2 at CF4/H2/Ar Plasma;Nanomaterials;2024-01-17
2. Influences of substrate temperatures on etch rates of PECVD-SiN thin films with a CF4/H2 plasma;Applied Surface Science;2021-03
3. Impact of hydrophobic plasma treatments on the barrier properties of poly(lactic acid) films;RSC Advances;2014
4. Improvement of Water Barrier Properties of Poly(ethylene-co-vinyl alcohol) Films by Hydrophobic Plasma Surface Treatments;The Journal of Physical Chemistry C;2012-06-01
5. Functionalization of sisal fibers and high-density polyethylene by cold plasma treatment;Journal of Applied Polymer Science;2002-06-14
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