Pulse plating of Ni-Cu alloys-Reference-Cited by-同舟云学术

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Pulse plating of Ni-Cu alloys

Published:1988-04 Issue:3 Volume:34 Page:243-252
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Cherkaoui M.,Chassaing E.,Vu Quang K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference20 articles.

1. Corrosion of Nickel and Nickel Alloys;Friend,1980

2. Proc. 7th Symp. on Electroplating;Oulladj,1985

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1. Engineering Grain Boundary Constitution in Pulse Electrodeposited Nickel Coatings for Enhanced Resistance to Electrochemical Degradation;Metallurgical and Materials Transactions A;2024-06-01

2. Effect of Additive Methyl Nicotinate on Electrochemical Behavior of Nickel–Copper Alloy Electrodeposition in ChCl-EG Deep Eutectic Solvents;Russian Journal of Physical Chemistry A;2023-12

3. Strategies to engineer FeCoNiCuZn high entropy alloy composition through aqueous electrochemical deposition;Electrochimica Acta;2023-06

4. Correlation Between Texture, Grain Boundary Constitution, and Corrosion Behavior of Ni-Cu Coatings;Metallurgical and Materials Transactions A;2022-02-10

5. Production of low-Sn Cu-Sn Alloy Coatings onto Steel Substrate Using Sodium Citrate Bath – Part 1: the Effect of Current Mode (DC or SPC) and Applied Current on the Chemical, Morphological, and Anticorrosive Properties of the Coatings;Materials Research;2022

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