Electric feed-through for vacuum package using double-side anodic bonding of silicon-on-insulator wafer

Author:

Chu Hoang Manh,Vu Hung Ngoc,Hane Kazuhiro

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Biotechnology,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Device-level vacuum packaging for RF MEMS;Rahman;J. Microelectromech. Syst.,2010

2. Vacuum wafer level packaged two-dimensional optical scanner by anodic bonding;Tachibana,2009

3. Compact low-voltage operation micro-mirror based on high vacuum seal technology using metal can;Chu;J. Microelectromech. Syst.,2010

4. Design, fabrication, and vacuum package process for high performance of 2D scanning MEMS micromirror;Chu,2011

5. Responsivity and detectivity modeling of thermal radiation sensors based on a biased thermocouple;Dillner;J. Phys. D Appl. Phys.,2011

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4. Shorting out bonding method for multi-stack anodic bonding and its application in wafer-level packaging;Modern Physics Letters B;2020-08-12

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