Thermomechanical vibration and buckling response of magneto-electro-elastic higher order laminated nanoplates
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Modeling and Simulation
Reference71 articles.
1. A Review on Functionally Gradient Materials (FGMs) and Their Applications;Singh,2017
2. A stress function based model for transient thermal stresses of composite laminates in various time-variant thermal environments;Huang;Int. J. Mech. Sci.,2020
3. A coupled efficient layerwise finite element model for free vibration analysis of smart piezo-bonded laminated shells featuring delaminations and transducer debonding;Kapuria;Int. J. Mech. Sci.,2021
4. FGM activities in Japan;Koizumi;Compos. Part B Eng.,1997
5. Additive manufacturing of functionally graded metallic materials: A review of experimental and numerical studies;Ghanavati;J. Mater. Res. Technol.,2021
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nonlinear vibration analysis of a double curved shallow sandwich shell in which the core made of three-phase nanocomposite and the two-outer layer of electromagnetic materials;Thin-Walled Structures;2024-03
2. The effect of the foam structure and distribution on the thermomechanical vibration behavior of sandwich nanoplates with magneto-electro-elastic face layers;Mechanics of Advanced Materials and Structures;2024-01-30
3. Nonlinear low-velocity impact of magneto-electro-elastic plates with initial geometric imperfection;Acta Astronautica;2024-01
4. On the role of surface stress tensor in the nonlinear response of time-dependent mechanical actuated nanoplate-type energy piezo-harvesters;Mechanics of Advanced Materials and Structures;2023-09-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3