Chemical changes of food constituents during cold plasma processing: A review
Author:
Publisher
Elsevier BV
Subject
Food Science
Reference112 articles.
1. Effects of cold plasma processing in food components;Alves Filho,2020
2. Effect of cold plasma treatment on antioxidants activity, phenolic contents and shelf life of fresh and dried walnut (Juglans regia.L) cultivars during storage;Amini;LWT - Food Science and Technology,2016
3. Cold plasma: A new technology to modify wheat flour functionality;Bahrami;Food chemistry,2016
4. Supramolecular structure and thermal behavior of cassava starch treated by oxygen and helium glow-plasmas;Bie;Innovative Food Science & Emerging Technologies,2016
5. Evolution and current status of research in phenolic compounds;Boudet;Phytochemistry,2007
Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Nonthermal plasma technologies for advanced functional material processing and current applications: Opportunities and challenges;Journal of Environmental Chemical Engineering;2024-10
2. Effect of cold plasma for modulating macromolecules and bioactive composition of food: Unveiling mechanisms and synergies with other emerging techniques;Food Bioscience;2024-10
3. Enhancement of rosehip bioactive compounds by cold plasma pretreatment and application of its extract as a functional ingredient in ketchup;Food Chemistry: X;2024-10
4. Impact of Nonthermal Plasma Treatment on the Oxidation of Lipids with Different Unsaturation Degrees;Journal of Agricultural and Food Chemistry;2024-08-27
5. Non-Thermal and Thermal Physical Procedures—Optimistic Solutions in the Winemaking Industry;Applied Sciences;2024-08-26
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3