3D Microengineering via Laser Direct-Write Processing Approaches-Reference-Cited by-同舟云学术

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3D Microengineering via Laser Direct-Write Processing Approaches

Published:2002 Issue: Volume: Page:415-474
ISSN:
Container-title:Direct-Write Technologies for Rapid Prototyping
language:
Short-container-title:

Author:

Helvajian Henry

Publisher

Elsevier

Reference248 articles.

1. UV FEL light source for industrial processing;Kelley,1996

2. Laser Processing for Microengineering Applications;Brannon,1999

3. Microactuators and their technologies;Thielicke;Mechatronics,2000

4. Task Force Report: Market Analysis for Microsystems;NEXUS (The Network of Excellence in Multifunctional Microsystems),1996

5. Silica glass: A material for photonics;Ikushima;J. Appl. Phys.,2000

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5. Development of an Inspector Satellite Propulsion Module Using Photostructurable Glass/Ceramic Materials;CANEUS 2004 Conference on Micro-Nano-Technologies;2004-01-07

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