Aging behavior and phase transformation of the Cu-0.2 wt%Zr-0.15 wt%Y alloy-Reference-Cited by-同舟云学术

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Aging behavior and phase transformation of the Cu-0.2 wt%Zr-0.15 wt%Y alloy

Published:2019-01 Issue: Volume:159 Page:367-373
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Gao Lingqing,Yang Xiao,Zhang Xianfeng,Zhang Yi^ORCID,Sun Huili,Li Nan

Funder

Open Cooperation Project of Science and Technology of Henan Province

Henan University Scientific and Technological Innovation Talent

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference36 articles.

1. Dynamic embrittlement in Cu-Cr-Zr-Ti alloy: evidence of intergranular segregation of Sulphur;Krishna;J. Mater. Eng. Perform.,2013

2. A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryorolling and intermediate aging treatment;Zhang;Mater. Sci. Eng., A,2017

3. Processing maps for the Cu-Cr-Zr-Y alloy hot deformation behavior;Zhang;Mater. Sci. Eng., A,2016

4. Effect of Zr on as-cast microstructure and properties of Cu-Cr alloy;Tian;Vacuum,2018

5. Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects;Sharma;Nanotechnology,2007

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1. Effects of aging processes on the microstructure, texture, properties and precipitation kinetics of the Cu–Cr–Zr–Nb alloy;Journal of Materials Research and Technology;2024-07

2. Microstructure and electrical contact properties of Al2O3-Cu/(Cr, Zr) composites;Materials Today Communications;2024-03

3. Texture evolution and strengthening mechanism of CuCrZr alloys during cold rolling;Vacuum;2024-03

4. Effects of aging process on properties and precipitation kinetics of Cu–Cr–Zr alloy strips;Transactions of Nonferrous Metals Society of China;2023-08

5. Ce effects on dynamic recrystallization and microstructure of the copper alloy under hot deformation behavior with different strain rate;Journal of Materials Research and Technology;2023-05

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