Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material-Reference-Cited by-同舟云学术

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Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material

Published:2015-08 Issue: Volume:118 Page:152-160
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Lee Chang-Chun,Lin Yu-Min,Guo Yu-Huan,Zhan Chau-Jie,Chang Tao-Chih,Dzeng Yu-Hua

Funder

Industrial Technology Research Institute

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference15 articles.

1. High-Density Through Silicon Vias for 3-D LSIs

2. Reliability challenges in 3D IC packaging technology

3. Reliability enhancements of chip-on-chip package with layout designs of microbumps

4. Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill

5. Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging reliability estimation of high-power device modules by utilizing silver sintering technology;Microelectronics Reliability;2020-11

2. Laminated process effect of high-density redistributed trace lines on the risk estimation of induced-stress failure for 3D-IC embedded interposer;Microsystem Technologies;2017-11-18

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