Evaluation of mechanical stresses in silicon substrates due to lead–tin solder bumps via synchrotron X-ray topography and finite element modeling-Reference-Cited by-同舟云学术

Evaluation of mechanical stresses in silicon substrates due to lead–tin solder bumps via synchrotron X-ray topography and finite element modeling

Published:2003-01 Issue:1-2 Volume:65 Page:209-221
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kanatharana J.,Pérez-Camacho J.J.,Buckley T.,McNally P.J.,Tuomi T.,Danilewsky A.N.,O’Hare M.,Lowney D.,Chen W.,Rantamäki R.,Knuuttila L.,Riikonen J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

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5. Intel Packaging Databook (http://developer.intel.com/design/PACKTECH/).

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