The Use of the Overstitch to Close Endoscopic Resection Defects
Author:
Funder
NIH
Publisher
Elsevier BV
Subject
Gastroenterology
Reference32 articles.
1. Underwater" EMR without submucosal injection for large sessile colorectal polyps (with video);Binmoeller;Gastrointest Endosc,2012
2. Endoscopic mucosal resection;Committee;Gastrointest Endosc,2015
3. Adverse events related to colonic endoscopic mucosal resection and polypectomy;Sethi;Gastrointest Endosc Clin N Am,2015
4. Endoscopic mucosal resection for large and giant sessile and flat colorectal polyps: a single-center experience with long-term follow-up;Luigiano;Endoscopy,2009
5. Risk factors for intraprocedural and clinically significant delayed bleeding after wide-field endoscopic mucosal resection of large colonic lesions;Burgess;Clin Gastroenterol Hepatol,2014
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Exposed endoscopic full-thickness resection and overstitch suture after incomplete nonexposed endoscopic full-thickness resection;VideoGIE;2023-06
2. Analysis of Reported Adverse Events Associated with Over-the-Scope Endoscopic Suturing System: an FDA MAUDE Database Study;Obesity Surgery;2023-02-21
3. Endoscopic suturing for GI applications: initial results from a prospective multicenter European registry;Gastrointestinal Endoscopy;2022-11
4. Feasibility of endoscopic resection without laparoscopic assistance for giant gastric subepithelial tumors originating from the muscularis propria layer (with video);Surgical Endoscopy;2022-01-20
5. Novel through-the-scope twin clip for the closure of GI wounds: the first experimental survival study in pigs (with videos);Gastrointestinal Endoscopy;2021-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3