Author:
Gladysz Gary M.,Chawla Krishan K.
Reference31 articles.
1. Grain Boundary Cavitation and Sliding in Copper/Tungsten Composites due to Thermal Stress;Chawla;Philosophical Magazine,1973
2. Composite Materials: Science and Engineering;Chawla,2012
3. Measurement and prediction of Young’s modulus of a Pb-free solder;Chawla;Journal of Materials Science: Materials in Electronics,2004
4. A model for boundary diffusion controlled creep in polycrystalline materials;Coble;Journal of Applied Physics,1963
5. Effect of porosity on physical properties of sintered alumina;Coble;Journal of the American Ceramic Society,1956
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