Author:
Tong Q.-Y.,Gösele U.,Martini T.,Reiche M.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Fabrication and bonding strength of bonding silicon—quartz wafers;Abe;Jpn. J. Appl. Phys.,1993
2. Closure and repropagation of healed cracks in silicate glass;Michalske;J. Am. Ceram. Soc.,1985
3. Silicon-on-insulator by wafer bonding: a review;Maszara;J. Electrochem. Soc.,1991
4. Wafer bonding technology for SOI applications: a review;Mitani;Proc. IEEE Int. SOI Conf.,1992
5. Plasma-thinning silicon-on-insulator bonded wafers;Mumola;Proc. 2nd Int. Symp. Semicond. Wafer Bonding: Sci. Technol. Appl.,1993
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献