Effects of pH on the Immersion Gold Process from a Sulfite-Thiosulfate Solution Based on the Electroless Ni-P Alloy Substrate
Author:
Publisher
Elsevier BV
Subject
Electrochemistry
Reference12 articles.
1. Gold Immersion Deposition on Electroless Nickel Substrates
2. The pH effect on black spots in surface finish: Electroless nickel immersion gold
3. Electroless nickel/immersion gold finishes for application to surface mount technology: A regenerative approach
4. Effects of surface finishes and current stressing on the interfacial reaction characteristics of Sn–1.2Ag–0.7Cu–0.4In solder bumps
5. Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
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