Acceleration mechanism of abrasive particle in ultrasonic polishing under synergistic physical vibration and cavitation: Numerical study-Reference-Cited by-同舟云学术

Acceleration mechanism of abrasive particle in ultrasonic polishing under synergistic physical vibration and cavitation: Numerical study

Published:2023-12 Issue: Volume:101 Page:106713
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Chen Xin,Xu Shucong,Ignacio Ahuir-Torres Juan,Wang Zixuan,Chen Xun,Yu Tianbiao,Zhao Ji

Funder

Fundamental Research Funds for the Central Universities

Major State Basic Research Development Program of China

Northeastern University

China Scholarship Council

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference63 articles.

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3. Effect of ultrasonic vibration on polishing monocrystalline silicon: surface quality and material removal rate;Yu;Int. J. Adv. Manuf. Technol.,2019

4. Ultrasonic-assisted anodic oxidation of 4H-SiC (0001) surface;Yang;Electrochem. Commun.,2019

5. Combined ultrasonic vibration and chemical mechanical polishing of copper substrates;Tsai;Int. J. Mach. Tools Manuf.,2012

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