Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference25 articles.
1. Thermal conductivity of W–Cu composites at various temperatures
2. Fabrication of W–20 wt % Cu composite nanopowder and sintered alloy with high thermal conductivity
3. Pressure sintering of W-15wt.%Cu alloys prepared by mechanical alloying as a subsequent densification treatment method
4. Effects of Applied Pressure on Densification During Sintering in the Presence of a Liquid Phase
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