Simulation of a hollow-cathode PECVD process in O2/TMDSO for silicon dioxide deposition – Cross-code validation of 2D plasma model and global plasma model-Reference-Cited by-同舟云学术

Simulation of a hollow-cathode PECVD process in O2/TMDSO for silicon dioxide deposition – Cross-code validation of 2D plasma model and global plasma model

Published:2023-12 Issue: Volume:474 Page:130069
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Tomanková Kristína,Kubečka Martin,Rivolta Nicolas,Cornil David,Obrusník Adam

Funder

European Coordinated Research on Long-term Challenges in Information and Communication Sciences & Technologies ERA-NET

Technology Agency of the Czech Republic

Ministerstvo Školství, Mládeže a Tělovýchovy

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

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