Effects of deposition method on the microstructure and intermetallic compound formation in Ag–Sn bilayers
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference42 articles.
1. Advances in lead-free electronics soldering
2. Handbook of Lead-free Solder Technology for Microelectronic Assemblies;Puttlitz,2004
3. The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films
4. Synthesis of high dispersed intermetallic Ag4Sn/C and its enhanced oxygen reduction reaction activity
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Enthalpies of mixing in ternary Ag–Eu–Sn liquid alloys;International Journal of Materials Research;2023-12-19
2. Functions of 2-butyne-1,4-diol in the process of tin-silver alloy electrodeposition from the acidic sulfate solution;Surfaces and Interfaces;2021-06
3. Asymmetry of interface reactions in Ag-Sn thin film couples—In-situ synchrotron radiation study;Journal of Applied Physics;2019-06-07
4. Use of magnetron sputtering with liquid target in manufacturing of electronic components for spacecraft;XLIII ACADEMIC SPACE CONFERENCE: dedicated to the memory of academician S.P. Korolev and other outstanding Russian scientists – Pioneers of space exploration;2019
5. Modified Solid State Dewetting of Plasmonic Pt NPs by Using In-Pt Bi-Layer System: Improvement on the Surface Morphology and LSPR Properties of Pt NPs;IEEE Transactions on Nanotechnology;2019
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3