Depth-dependent self-annealing behavior of electroplated Cu-Reference-Cited by-同舟云学术

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Depth-dependent self-annealing behavior of electroplated Cu

Published:2017-06 Issue: Volume:320 Page:489-496
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Chen Chang-Chih,Yang Cheng-Hsien,Wu Ying-Syuan,Ho Cheng-En

Funder

Ministry of Science and Technology (R.O.C.)

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference41 articles.

1. Multilevel interconnections for ULSI and GSI era

2. Grain Growth, Stress, and Impurities in Electroplated Copper

3. Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

4. Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)

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