Measurement of interfacial toughness of metal film wire and polymer membrane through electricity induced buckling method-Reference-Cited by-同舟云学术

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Measurement of interfacial toughness of metal film wire and polymer membrane through electricity induced buckling method

Published:2011-06 Issue:2 Volume:358 Page:491-496
ISSN:0021-9797
Container-title:Journal of Colloid and Interface Science
language:en
Short-container-title:Journal of Colloid and Interface Science

Author:

Wang Qinghua,Xie Huimin,Lu Jian,Chen Pengwan,Zhang Qingming

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. MEMS and Microsystems: Design and Manufacture;Hsu,2002

2. Flexible electronic futures

3. Flexible Electronics: Materials and Applications,2009

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4. Dynamic buckling behavior of thin metal film lines from substrate;Journal of Micromechanics and Microengineering;2014-09-10

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