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Microwave processing of adhesive joints using a temperature controlled feedback system

  • Published:2001-01 Issue:2 Volume:41 Page:209-225
  • ISSN:0890-6955
  • Container-title:International Journal of Machine Tools and Manufacture
  • language:en
  • Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Olofinjana Ayodele,Yarlagadda Prasad K.D.V,Oloyede Adekunle

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference14 articles.

1. R.G. Baker, Adhesive bonding of metals and plastics, in: Joining and Materials, January 1988, pp. 124-127.

2. Dielectric properties of curing epoxy/amine system at microwave frequencies;Finzel;Polymer Science and Engineering,1991

3. Advances in Adhesives;Brewis,1983

4. General Introduction;Kemp,1989

5. Adhesive and sealant;Brinson,1990

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