Grain boundary penetration of nickel by liquid bismuth as a film of nanometric thickness
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference11 articles.
1. Tie lines of the grain boundary wetting phase transition in the Al-Sn System
2. Rapid penetration of liquid Bi along Cu grain boundaries
3. Instability of grain boundary grooves due to equilibrium grain boundary diffusion
4. A mechanism for the stress independant grain boundary penetration of a metal by a liquid metal. Application to the metallic couple Al-Ga
5. E. Rabkin and W. Gust, in Ceramic Interfaces: Properties and Applications, ed. Smart and Nowotny, p. 151, London (1998).
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