Subject
General Physics and Astronomy
Reference19 articles.
1. What is a BGA | SMD Ball Grid Array | Electronics Notes [Internet];electronics notes;Electronics-Notescom,2019
2. N. E. Gorji, B. K. Tanner, R. K. Vijayaraghavan, A. N. Danilewsky and P. J. McNally, “Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques,” 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017) 520-525. https://doi.org/10.1109/ECTC.2017.175.
3. Application of automation for in-line quality inspection, a zero-defect manufacturing approach;Azamfirei;J Manuf Syst,2023
4. Industrial applications of computed tomography;Chiffre;CIRP Ann,2014
5. Automated Void Detection in Solder Balls in the Presence of Vias and Other Artifacts;Said;IEEE Trans Compon Packag Manuf Technol,2012
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献