Subject
Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Low Cost Flip Chip Technologies;Lau,2000
2. Solder Joint Reliability of BGA, CSP, Flipchip and Fine Pitch SMT Assemblies;Lau,1997
3. Electronic Components and Technology Conference;Brownlee,2003
4. Electronic Components and Technology Conference;Li,2002
5. Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
Cited by
145 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献