Improving cooling efficiency by increasing fan power usage-Reference-Cited by-同舟云学术

Improving cooling efficiency by increasing fan power usage

Published:2000-10 Issue:9-10 Volume:31 Page:765-771
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Wang D.G,Muller P.K

Publisher

Elsevier BV

Subject

General Engineering

Reference12 articles.

1. D. Wang, Cooling solutions for a no-air-flow and low-junction-temperature application, Second Electronics Packaging Technology Conference, Singapore, 1998, pp. 133–137.

2. Modeling and metrology for expedient analysis and design of computer systems;Bush;The International Journal of Microcircuits and Electronic Packaging,1999

3. Standardizing heat sink characterization for forced convection;Belady;Electronics Cooling,1997

4. A simple method to estimate heat sink air flow bypass;Simons;Electronics Cooling,1997

5. T. Yuan, Computation modeling of flow bypass effects on straight fin heat sink in rectangular duct, 12th IEEE SEMI-THERM Symposium, 1996, pp. 164–168.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimizing Cooling Fan Power Consumption for Improving Diesel Engine Fuel Efficiency Using CFD Technique;SAE International Journal of Engines;2019-06-11

2. Cooling of a Processor With the Use of a Heat Pump;Civil and Environmental Engineering Reports;2018-03-01

3. Temperature Profiles in a Micro Processor Cooled by Direct Refrigerant Evaporation;Civil And Environmental Engineering Reports;2016-09-01

4. Development of novel spindle motor with dual air gaps to improve output torque;Microsystem Technologies;2015-09-28

5. INFLUENCE OF GEOMETRIC PARAMETERS ON CENTRIFUGAL FAN PERFORMANCE AND ITS SIGNIFICANCE IN AUTOMOTIVE APPLICATIONS;International Journal of Modeling, Simulation, and Scientific Computing;2012-05-17