1. Multichip Module Technology Handbook;Garrou,1998
2. Dielectric properties of epoxy/silica composites used for microelectronic packaging, and their dependence on post-curing;Gonon;Journal of Materials Science: Materials in Electronics,2001
3. A precise numerical prediction of effective dielectric constant for polymer–ceramic composite based on effective-medium theory;Rao;IEEE Transactions on Components and Packaging Technologies,2000
4. Effective-medium theory for two-phase random composites with an interfacial shell;Xue;Journal of Materials Science and Technology,2000
5. Ab initio simulation approach for calculating the effective dielectric constant of composite materials;Sareni;Journal of Electrostatics,1997