1. The cleaning at a back surface and edge of a wafer for introducing Cu metallization process;Itoh;IEEE Transactions on Semiconductor Manufacturing,2000
2. Removing postash polymer residue from BEOL structures using inorganic chemical;Archer;Micro,2001
3. Meeting ITRS roadmap challenges with low-k dielectric etching;Thomas;Solid State Technology,2001
4. Top surface imaging improves copper process resolution;Gadson;Solid State Technology,2001