Author:
Yu Cuiping,Gong Wenbin,Tian Wei,Zhang Qichong,Xu Yancui,Lin Ziyin,Hu Ming,Fan Xiaodong,Yao Yagang
Funder
National Natural Science Foundation of China
Key Research Program of Frontier Science of Chinese Academy of Sciences
Thousand Youth Talents Plan, the Postdoctoral Foundation of China
Natural Science Foundation of Jiangsu Province, China
Postdoctoral Foundation of Jiangsu Province
the Science and Technology Project of Suzhou, China
Subject
General Engineering,Ceramics and Composites
Reference46 articles.
1. Materials for Advanced Packaging;Lu,2009
2. Nano-bio-electronic, Photonic and MEMS Packaging;Wong,2010
3. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
4. Thermal Management of On-Chip Hot Spot
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