The tensile fatigue behaviour of a silica nanoparticle-modified glass fibre reinforced epoxy composite
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference37 articles.
1. Nanocomposites in context;Thostenson;Compos Sci Technol,2005
2. Polymer–matrix nanocomposites, processing, manufacturing, and application: an overview;Hussain;J Compos Mater,2006
3. The effect of silica nanoparticles and rubber particles on the toughness of multiphase thermosetting epoxy polymers;Kinloch;J Mater Sci,2005
4. Toughening mechanisms of nanoparticle-modified epoxy polymers;Johnsen;Polymer,2007
5. Effect of inorganic nanoparticles on mechanical property, fracture toughness and toughening mechanism of two epoxy systems;Ma;Polymer,2008
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