Electrochemical impedance characteristics of Ta/Cu contact regions in polishing slurries used for chemical mechanical planarization of Ta and Cu: considerations of galvanic corrosion-Reference-Cited by-同舟云学术

Electrochemical impedance characteristics of Ta/Cu contact regions in polishing slurries used for chemical mechanical planarization of Ta and Cu: considerations of galvanic corrosion

Published:2006-02 Issue:2 Volume:48 Page:372-388
ISSN:0010-938X
Container-title:Corrosion Science
language:en
Short-container-title:Corrosion Science

Author:

Assiongbon K.A.,Emery S.B.,Gorantla V.R.K.,Babu S.V.,Roy D.

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference40 articles.

1. Chemical–mechanical Polishing 2001: Advances and Future Challenges,2001

2. Investigation of barrier and slurry effects on the galvanic corrosion of copper

3. Narrow Trench Corrosion of Copper Damascene Interconnects

4. Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

5. Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures

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