Thermal stability of Cu@Ag core–shell nanoparticles
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference37 articles.
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3. Electronics Without Lead
4. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications
5. Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics
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