Author:
Zia Rashid,Schuller Jon A.,Chandran Anu,Brongersma Mark L.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference48 articles.
1. Impact of joule heating on scaling of deep sub-micron Cu/low-k interconnects;Chiang;IEEE Symp. VLSI Circuits, Dig. Tech. Papers,2002
2. Studio courses: How information technology is changing the way we teach, on campus and off
3. Predictions of CMOS compatible on-chip optical interconnect;Chen;Int. Workshop System Level Interconnect Prediction,2005
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