Wafer slicing by internal diameter sawing-Reference-Cited by-同舟云学术

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Wafer slicing by internal diameter sawing

Published:1988-01 Issue:1 Volume:10 Page:29-34
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Struth W.F.,Steffens K.,König W.

Publisher

Elsevier BV

Subject

General Engineering

Reference10 articles.

1. I.D. Sawing-Diameters Increase;Büttner;IDR,1985

2. Werkzeugkatalog Ernst Winter & Söhne;Anon Diamond Tools for the Electronic Industry,1984

3. Slicing and grinding semiconductor materials;Brandt;IDR,1985

4. Anon Annular Saw. Firmenkatalog Meyer & Burger, Steffisburg. Switzerland

5. Anon Automatische Innelochsäge IDS 33. Firmenkatalog Georg Müller Nürnberg (GMN), Nürnberg

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