1. Accurate BGA package solder joint modeling for high speed SerDes interfaces;Sun,2020
2. Electrical modeling of a BGA package for microwave applications-A layer by layer approach;Ito,1998
3. Full wave analysis and development of circuit models for flip chip interconnects;Staiculescu,1998
4. Package model for efficient simulation, design, and characterization of high performance electronic systems;Pham,2006
5. A wideband model for high density ball-grid array packages for very high speed digital circuits;Yassini,2000