Demonstration of an integrated-heating load frame for quantitatively assessing microscale tensile properties of copper and Zircaloy-2-Reference-Cited by-同舟云学术

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Demonstration of an integrated-heating load frame for quantitatively assessing microscale tensile properties of copper and Zircaloy-2

Published:2024-12 Issue: Volume:601 Page:155339
ISSN:0022-3115
Container-title:Journal of Nuclear Materials
language:en
Short-container-title:Journal of Nuclear Materials

Author:

Mirmohammad Hadi^ORCID,Regmi Abiral^ORCID,Chang Jiyoung^ORCID,Kingstedt Owen^ORCID

Funder

US Department of Energy

Publisher

Elsevier BV

Reference112 articles.

1. Fracture strength of micro- and nano-scale silicon components;DelRio;Appl. Phys. Rev.,2015

2. Microscale characterization of mechanical properties;Hemker;Annu. Rev. Mater. Res.,2007

3. A review of microelectromechanical systems for nanoscale mechanical characterization;Zhu;J. Micromech. Microeng.,2015

4. Deformation of single crystals, polycrystalline materials, and thin films: a review;Yang;Materials,2019

5. Creep behavior of nanocrystalline au films as a function of temperature;Karanjgaokar;J. Mater. Sci.,2016

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