Rapid soldering reactions of eutectic snpb and eutectic SnBi on Pd surfaces
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference16 articles.
1. Palladium as a lead finish for surface mount integrated circuit packages
2. Metal Sci. Joining;Boettinger,1992
3. H.K. Kim, H.K. Liou, and K.N. Tu, unpublished.
4. Effect of Sn content of Pb-Sn solder alloys on wetting dynamics
5. Characterization of eutectic Sn-Bi solder joints
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2. Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy;Metallurgical and Materials Transactions A;2010-09-17
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