High-speed energy efficient selective removal of large area copper layer by laser induced delamination

Author:

Kmetec Blaž,Kovačič Drago,Možina Janez,Podobnik Boštjan

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference19 articles.

1. Laser material processing in microelectronics manufacturing: status and near-term opportunities;Dunsky,2005

2. On the application of a novel laser-based rapid prototyping process for planar antenna elements;Klemp,2006

3. B. Podobnik, D. Kovačič, M. Poplašen, Verfahren zum partiellen Lösen einer leitfähigen Schicht, PatentDe—DE1020040066414A1, also: European Patent EP1716730 (Method for partial removal of a conductive layer) (August 2005).

4. Laser-based system speeds PCB prototypes;Schmidt;Microwaves and RF,2005

5. Optimisation of direct laser structuring of printed circuit boards;Rozman;Applied Surface Science,2008

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