High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes-Reference-Cited by-同舟云学术

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High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

Published:2018-03 Issue: Volume:434 Page:1353-1360
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Ho C.E.,Hsieh W.Z.,Lee P.T.,Huang Y.H.,Kuo T.T.

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference31 articles.

1. Rapid sintering of copper nano ink using a laser in air;Yu;Int. J. Precis. Eng. Manuf.,2014

2. Development and evaluation of direct deposition of Au/Pd(P) bilayers over Cu pads in soldering applications;Ho;J. Electron. Mater.,2012

3. Interfacial reaction and mechanical characterization of Sn-Ag-Cu/Au/Pd(P)/Cu solder joints: thick Pd(P) deposition;Ho;J. Electron. Mater.,2015

4. The pH effect on black spots in surface finish: electroless nickel immersion gold;Won;Appl. Surf. Sci.,2010

5. Deposition and characterization of thin electroless palladium films from newly developed baths;Chou;Thin Solid Films,1992

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