Morphology and stress at silicon-glass interface in anodic bonding

Author:

Tang Jiali,Cai Cheng,Ming Xiaoxiang,Yu Xinhai,Zhao Shuangliang,Tu Shan-Tung,Liu Honglai

Funder

China Natural Science Foundation

Innovation Program of Shanghai Municipal Education Commission

Fundamental Research Funds for the Central Universities

Shanghai Science and Technology Committee Rising-Star Program

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference33 articles.

1. Field assisted glass-metal bonding;Wallis;J. Appl. Phys.,1969

2. Failure mechanisms of pressurized micro-channels model, and experiment;Blom;J. Microelectromech. Syst.,2001

3. Vacuum packaging for micro-sensors by glass-silicon anodic bonding;Henmi;Sens. Actuators A,1994

4. Monolithic silicon accelerometer with integral air damping and over-range protection;Barth,1988

5. Wafer-to-wafer bonding for microstructure formation;Schmidt;Proc. IEEE,1998

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