Controlled electropolishing of copper foils at elevated temperature-Reference-Cited by-同舟云学术

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Controlled electropolishing of copper foils at elevated temperature

Published:2014-07 Issue: Volume:307 Page:731-735
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kwon Gi Duk,Kim Young Woo,Moyen Eric,Keum Dong Hoon,Lee Young Hee,Baik Seunghyun,Pribat Didier

Funder

Human Resources Development

Korea Institute of Energy Technology Evaluation and Planning

Korea government Ministry of Trade, Industry and Energy

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference30 articles.

1. Electrochemical micromachining, polishing and surface structuring of metals: fundamental aspects and new developments

2. Electrolytic Method for obtaining Bright Copper Surfaces

3. The influence of solution flow on anodic polishing. Copper in aqueous o-phosphoric acid

4. Electrochemical Planarization for Multilevel Metallization

5. Pattern Effects on Planarization Efficiency of Cu Electropolishing

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1. Review—Principles and Applications of Electrochemical Polishing;Journal of The Electrochemical Society;2024-09-02

2. High efficiency polishing of micro-structured NiP alloy using isotropic electrochemical etching for achieving sub-nanometer roughness;Journal of Manufacturing Processes;2024-07

3. High-efficiency polishing of micro-structured NiP alloy using isotropic electrochemical etching for achieving sub-nanometer roughness;2023 2nd International Conference on Optical Imaging and Measurement (ICOIM);2023-10-20

4. Electropolishing Stainless Steel Optimization Using Surface Quality, Dimensional Accuracy, and Electrical Consumption Criteria;Materials;2023-02-21

5. Growth and Characterization of Graphene Layers on Different Kinds of Copper Surfaces;Molecules;2022-03-09

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