Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

Author:

Chen Linghan,Chen Qian,Ando Daisuke,Sutou Yuji,Kubo Momoji,Koike Junichi

Funder

JSPS KAKENHI

New Energy and Industrial Technology Development Organization

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference44 articles.

1. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, N. Lustig, P. Roper, T. McDevitt, W. Motsiff, A. Simon, J. Dukovic, R. Wachnik, H. Rathore, R. Scultz, L. Su, S. Luce, J. Slattery, 1997 IEEE International Electron Devices Meeting, IEEE, 1997, pp. 773–776.

2. Elemental vacancy diffusion database from high-throughput first-principles calculations for fcc and hcp structures

3. Advanced copper interconnections for silicon CMOS technologies

4. T. Nogami, 2019 IEEE Electron Devices Technology and Manufacturing Conference, IEEE, 2019, pp. 38–40.

5. J. Kelly, J.H.-C. Chen, H. Huang, C.K. Hu, E. Liniger, R. Patlolla, B. Peethala, P. Adusumilli, H. Shobha, T. Nogami, T. Spooner, E. Huang, D. Edelstein, D. Canaperi, V. Kamineni, F. Mont, S. Siddiqui, 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference, IEEE, 2016, pp. 40–42.

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Electrical Resistivity Modification of Electrodeposited Mo and Mo–Co Nanowires for Interconnect Applications;Engineering;2023-10

2. Resistivity size effect in epitaxial VNi2 layers;Journal of Applied Physics;2023-09-13

3. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15

4. CuAl intermetallic compound for Cu alternative;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05

5. Resistivity scaling in CuTi determined from transport measurements and first-principles simulations;Journal of Applied Physics;2023-01-24

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3