Adhesion strength and nucleation thermodynamics of four metals (Al, Cu, Ti, Zr) on AlN substrates-Reference-Cited by-同舟云学术

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Adhesion strength and nucleation thermodynamics of four metals (Al, Cu, Ti, Zr) on AlN substrates

Published:2015-12 Issue: Volume:357 Page:8-13
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Tao Yuan,Ke Genshui,Xie Yan,Chen Yigang,Shi Siqi,Guo Haibo

Funder

Shanghai Pujiang Program

National Natural Science Foundation of China (NSFC)

Shanghai Municipal Education Commission

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference39 articles.

1. High thermal conductivity aluminum nitride cermaic substrates and packages;Miyashiro;IEEE Trans. Compon.,1990

2. Room-temperature direct current operation of 290nm light-emitting diodes with milliwatt power levels;Fischer;Appl. Phys. Lett.,2004

3. Power performance of AlGaN-GaN HEMTs grown on SiC by plasma-assisted MBE;Rajan;IEEE Electron Dev. Lett.,2004

4. An aluminium nitride light-emitting diode with a wavelength of 210 nanometres;Taniyasu;Nature,2006

5. Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperatures;Ozgit-Akgun;J. Mater. Chem. C,2014

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