Formation of a metal/epoxy resin interface-Reference-Cited by-同舟云学术

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Formation of a metal/epoxy resin interface

Published:2005-01 Issue:2 Volume:239 Page:227-236
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kanzow J.,Horn P.Schulze,Kirschmann M.,Zaporojtchenko V.,Dolgner K.,Faupel F.,Wehlack C.,Possart W.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference19 articles.

1. Diffusion of metals in polymers

2. Characterization and aluminum metallization of a parylene AF-4 surface

3. X-ray photoelectron spectroscopy studies of the evaporated aluminum/corona-treated polyethylene terephthalate interface

4. Surface modification for improved adhesion of a polymer–metal compound

5. Diffusion of Gold and Silver in Bisphenol A Polycarbonate

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1. Morphology of ultrathin gold and copper coatings thermally evaporated on polydimethylsiloxane elastomers: From isolated nanoparticles to continuous coatings;Thin Solid Films;2023-09

2. Investigation of Two-Step Metallization Process of Plastic 3D Prints Fabricated by SLA Method;Archives of Metallurgy and Materials;2023-07-26

3. An overview of interphase’s formation and participation on water diffusion in epoxy/metal bonded assemblies;The Journal of Adhesion;2023-05-03

4. Fabrication and Compressive Strength of Functionally Graded Dual Filler Polymer Composite Materials;Advances in Manufacturing, Automation, Design and Energy Technologies;2023

5. The influence of ambient cure chemistry and stoichiometry on epoxy coating surfaces;RSC Advances;2022

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