Author:
Wolf Steven,Breeden Michael,Kwak Iljo,Park Jun H.,Kavrik Mahmut,Naik Mehul,Alvarez Daniel,Spiegelman Jeffrey,Kummel Andrew C.
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference37 articles.
1. Diffusion barrier deposition on a copper surface by atomic layer deposition;Elers;Chem. Vap. Depos.,2002
2. H. O. Pierson, Handbook of Refractory Carbides & Nitrides: Properties, Characteristics, Processing and Apps. (William Andrew, 1996).
3. Evaluation of contact and via step coverage using a novel two-step titanium nitride barrier deposition process;Sidhwa;MRS Proceedings,2011
4. Understanding the role of TiN barrier layer on electrical performance of MOS device with ALD-TiN/ALD-TiAlC metal gate stacks;Xiang;ECS J. Solid State Sci. Technol.,2016
5. F. Chen, O. Bravo, K. Chanda, P. McLaughlin, T. Sullivan, J. Gill, J. Lloyd, R. Kontra, J. Aitken, in: Reliability Physics Symposium Proceedings, 2006, 44th Annual., IEEE International. (IEEE, 2006), pp. 46-53.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献