Brush Scrubbing for Post-CMP Cleaning-Reference-Cited by-同舟云学术

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Brush Scrubbing for Post-CMP Cleaning

Published:2017 Issue: Volume: Page:109-133
ISSN:
Container-title:Developments in Surface Contamination and Cleaning, Volume 9
language:
Short-container-title:

Author:

Sun Ting,Han Zhenxing,Keswani Manish

Publisher

Elsevier

Reference53 articles.

1. Chemical Mechanical Planarization of Semiconductor Materials;Oliver,2004

2. M. A. Fury, “Emerging Developments in CMP for Semiconductor Planarization”, Solid State Technol. 38, 81 (1995).

3. Chemical Mechanical Planarization of Microelectronic Materials;Steigerwald,1997

4. Brush Scrubbing Emerges as Future Wafer-Cleaning Technology;Hymes;Solid State Technol.,1997

5. Post-Tungsten CMP Cleaning: Issues and Solutions;Myers;Solid State Technol.,1995

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review—Post-Chemical Mechanical Planarization Cleaning Technology;ECS Journal of Solid State Science and Technology;2023-11-01

2. Recent advances and future developments in PVA brush scrubbing cleaning: A review;Materials Science in Semiconductor Processing;2022-12

3. Wet Chemical Processes for BEOL Technology;Springer Handbook of Semiconductor Devices;2022-11-11

4. Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD;Computational Materials Science;2022-11

5. Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films;Materials Science in Semiconductor Processing;2022-03

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