Disbond contours evaluation in aluminum/CFRP adhesive joint based on excitation recovery of Lamb waves
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference36 articles.
1. Salt spray fog ageing of hybrid composite/metal rivet joints for automotive applications;Fiore;Compos Part B Eng,2017
2. NaOH etching and resin pre-coating treatments for stronger adhesive bonding between CFRP and aluminium alloy;Hu;Compos Part B Eng,2019
3. Directing helical CNT into chemically-etched micro-channels on aluminum substrate for strong adhesive bonding with carbon fiber composites;Cheng;Compos Part A Appl Sci Manuf,2020
4. Evaluation of optimum configuration of adhesively bonded reverse bent joints;Bodepudi;Int J Adhes Adhes,2017
5. Effect of the geometry in the strength of single-lap adhesive joints of composite laminates under uniaxial tensile load;Moya-Sanz;Int J Adhes Adhes,2017
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Bolt looseness detection in lap joint based on phase change of Lamb waves;Mechanical Systems and Signal Processing;2025-01
2. Exploiting Rayleigh waves in layered materials for the localization of near-surface cracks;International Journal of Mechanical Sciences;2024-09
3. A variable kinematic multi-field model for lamb wave propagation analysis in smart composite panels;Mechanics of Advanced Materials and Structures;2024-08-06
4. Lamb wave-based damage assessment for composite laminates using a deep learning approach;Ultrasonics;2024-07
5. Theoretical Analysis for Propagation Behavior of Ultrasonic Guided Waves in CFRP Stiffened Panels;Journal of the Japan Society for Composite Materials;2024-05-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3