Impact resistance of bio-inspired sandwich beam with side-arched and honeycomb dual-core
Author:
Funder
Universiti Malaysia Sarawak
Universiti Teknologi Malaysia
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference46 articles.
1. Computational models for sandwich panels and shells;Noor;Appl Mech Rev,1996
2. Bending, buckling and free vibration of laminated composite and sandwich beams: A critical review of literature;Sayyad;Compos Struct,2017
3. A review of low-velocity impact on sandwich structures;Chai;Proc Inst Mech Eng Part L J Mater Des Appl,2011
4. Nondestructive evaluation of sandwich structures: a review of some inspection techniques;Hsu;J Sandw Struct Mater,2009
5. Nondestructive evaluation of thick-section composites and sandwich structures: A review;Ibrahim;Compos Part A Appl Sci Manuf,2014
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